Published January 9, 2023
| Version v1
Project milestone
Open
Wafer layout
- 1. UniTn
- 2. IMB-CNM
- 3. FBK Trento
Description
In the framework of the Task 6.4 (WP6) of AIDAInnova, four sensor productions with high timing and tracking resolutions are planned by two vendors, CNM and FBK. This document reports on the readiness of the technological choices and wafer layouts and the completion of MS22 in Month 18.
Files
AIDAinnova-MS22.pdf
Files
(1.7 MB)
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