Published September 22, 2022
| Version v1
Project milestone
Open
Combined workplan with objectives and test definition for all technologies
- 1. CERN
- 2. CSEM
- 3. LIT
- 4. CSIC
Description
This document describes the agreed plan of action for the Task 10.2, “Engineering of optimized cooling substrates”. The planned R&D activities aim at three objectives:
• Develop the process of cooling channel integration in CMOS into scalable solutions
• Define the optimal geometrical features attainable for 3D printed ultra-thin cold plates in metal alloys and ceramic composites
• Optimize the integration level of cooling features into ultra-light carbon composite structures
Files
AIDAinnova_MS41.pdf
Files
(411.1 kB)
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