TINKER_WP5_intial gap filling data with conductive silver patterns_270521

This dataset folder contains an initial attepmt to do gap filling and print conductive silver lines across the filled gap to connect the condctive pad of the chip. There are four folders: microscope images of PCBs after printing, overall PCB images, printing patterns folder, and screenshots during printing. There is also a ppt file documenting the process and evaluating the output data.