Published August 12, 2021
| Version v1
Presentation
Open
Impact of Extended Defects on the yield and Performance of 4H-SiC Power Devices
Creators
- 1. Fraunhofer Institute for Integrated Systems and Device Technology IISB
Description
Outline
- Introduction: Yield, performance and reliability of 4H-SiC power devices
- Influences on yield/performance of 4H-SiC power devices
- Process variations: A example (lithography)
- Extended epitaxial defects
- An overview
- Stacking faults - Dark triangle defects
- Stacking faults - Light triangle defects
- Surface pits in implanted areas
- Influence of epitaxial defects on gate oxide performance
- Conclusion
Files
Holger_Schlichting_MOS-AK_Xian_2021.pdf
Files
(2.7 MB)
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