Published June 4, 2017
| Version v1
Dataset
Open
A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology-dataset
Creators
- 1. Chalmers University of Technology, Gothenburg, Sweden
- 2. Infineon Technologies Austria AG, Villach, Austria
- 3. 1 Chalmers University of Technology, Gothenburg, Sweden
- 4. Ericsson AB, Gothenburg, Sweden
- 5. KTH Royal Institute of Technology, Stockholm, Sweden
Description
This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Ball Grid Array (eWLB) commercial process. The transition is realized through a patch slot antenna directly radiating to a standard waveguide opening. The interconnect achieves low insertion loss and good bandwidth. The measured minimum Insertion Loss (IL) is 2 dB and the average is 3 dB across a bandwidth of 22% covering the frequency range 110-138 GHz. In addition, the structure is easy to integrate as it does not require any special assembly nor any galvanic contacts. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz.
Files
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Additional details
Related works
- Is supplement to
- 10.5281/zenodo.815930 (DOI)