D2.4 Development of IMHyPE and thermoforming - 1

Deliverable 2.4 - Report about the development of IMHyPE and thermoforming – 2 exposes advances related to WP2 – T2.3 – Plastic processing. It is a continuation of the work exposed in first release of the deliverable (D2.2), related to the thermoforming and/or over-moulding process on selected substrates for demonstrators and active components as antennas and organic photodetectors (OPD).
Regarding antennas, compatibility of the selected thermoplastic for injection, TPU, with cellulose nanofibrils (CNF) foils has been analysed. Firstly, it has been proved that a reduction of the thickness of the TPU layer avoid cracking of the CNF upon bending. Secondly, adhesion between both materials has been addressed by testing different grades of CNF: with additional coatings like PVDC, PU and others, with different grades of roughness obtained by μ-embossing and with new grade of nanocellulose with sorbitol.
For injection moulding process of the tag a mould with a cavity to host the MCU was manufactured. Several injection tests were conducted to optimize injection parameters.
Regarding fingerprint sensor, the thermoforming tests on the PI/TPU/PC stack presented in D2.2 has continued. These initial set of experiments has enabled to test the resistance of the stack of substrate materials to the shape of demo 2 mould. During this period, the resistance to strain of deposited MoCr lines was evaluated. Test structures containing TFT and OPD has been used to test the resistance of these devices to pressure and temperature applied during the thermoforming and injection moulding step. Finally, the injection mould for the fingerprint sensor has been designed.
The partners participating in this task are EUT, TNO, INF, UWL and AWCP. D2.4 summarizes the most relevant results exposed in D2.4 and exposes the work carried out from month 15 to month 20.