Published January 9, 2023
| Version v1
Project milestone
Open
Availability of parts and definition of technologies for wafer-to-wafer hybridization
Description
Within WP6 (Hybrid Pixel Sensors for 4D Tracking and Interconnection Technologies) Milestone MS25 contains the availability of parts and definition of technologies for wafer-to-wafer hybridization.
This milestone has been successfully achieved and is reported in this document.
Files
AIDAinnova-MS25.pdf
Files
(1.2 MB)
| Name | Size | Download all |
|---|---|---|
|
md5:36e1370b6b00c21e5381af0834359373
|
1.2 MB | Preview Download |