Data for: Condition monitoring system for in situ crack detection based on thermal emissions

The advent of packaged infra-red (IR) bolometer detectors has led to thermography-based techniques becoming popular for non-destructive evaluation of aerospace structures. These packaged bolometers are relatively compact and cost about 10% the price of high-resolution IR photovoltaic effect detectors. In this work, a condition monitoring system for in situ crack detection has been presented which utilises an original equipment manufacturer (OEM) microbolometer detector. The proposed system cost approximately 1% the price of a state-of-the-art photovoltaic effect detector system and has the potential to transform the use of IR imaging for condition monitoring in the aerospace industry and elsewhere. The proposed system performs crack detection based on the principles of thermoelastic stress analysis (TSA), which is a well-established non-destructive thermography technique. Proof-of-concept lab tests were performed on open-hole aluminium specimens to compare the performance of the proposed system against an IR photovoltaic effect detector system and demonstrate its potential application for in situ crack detection in industrial environments. It was demonstrated that crack detection is possible from loading waveform signals with frequencies as low as 0.3 Hz. This represents a significant advance in the viability of TSA-based crack detection in large-scale structural tests where loading frequencies are usually lower than 1 Hz.