Kinematic Fields Measurement during Orthogonal Cutting : New High-Speed Imaging System and Experimental set-up.

Application of the Digital Image Correlation technique for kinematic fields measurement during orthogonal cutting allows to identify localized deformation band. However, ensuring a random speckle pattern in the sub-millimetric region of interest is crucial. In this paper, light issues are discussed. Optical solutions to enhance the light intensity within a sub-millimetric region of interest are given. According to the size of this region, a dedicated high-speed imaging system is proposed. Identification of the optical parameters function of the cutting conditions is discussed. The experimental setup is presented and first orthogonal cutting tests are conducted for validation. Finally, Digital Image Correlation (DIC) technique is applied to measure the kinematic fields during one segment chip formation.