Ultrafast thin-disk multi-pass amplifier system providing 1.9 kW of average output power and pulse energies in the 10 mJ range at 1 ps of pulse duration for glass-cleaving applications

An ultrafast Yb-doped thin-disk multi-pass laser amplifier system with flexible parameters for material processing is reported. We can generate bursts consisting of four pulses at a distance of 20 ns and a total energy of 46.7 mJ at a repetition rate of 25 kHz. In single-pulse operation, 1.5 kW of average output is achieved at 400 kHz when optimizing for a beam quality of M² =1.5. Alignment for maximum output power provides 1.9 kW at the same repetition rate. All results are obtained without chirped-pulse amplification in the multi-pass set-up. The application potential of the system is demonstrated exploring its performance in materials processing of dielectrics. Cleaving of 3.8-mm-thick SCHOTT borofloat glass with a velocity of 1200 mm/s is demonstrated with 300 W of input power. Single-pass modification of 30 mm borosilicate glass is enabled with a Bessel beam at 1 kW of average power delivered by four-pulse bursts of an energy of 30 mJ.