Published June 17, 2020 | Version Published
Dataset Open

In-situ study of creep in Sn-3Ag-0.5Cu solder

Creators

  • 1. Imperial College London
  • 2. National Physical Laboratory

Description

The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013

Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1

  1. Department of Materials, Imperial College London, SW7 2AZ. UK
  2. Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK

*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634

*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)

The data bundle was prepared by Tianhong Gu

Files

Data bundle.zip

Files (38.0 MB)

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