MICROPRINCE - Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level

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Published November 20, 2019 | Version v1
Poster Open

MICROPRINCE - Micro-Transfer-Printing of Functional Components on Wafer Level

Authors/Creators

  • 1. X-FAB

Description

Poster presented at the EFECS 2019.

Files

EFECS 2019_MICROPRINCE.pdf

Files (3.5 MB)

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Additional details

Funding

European Commission
MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level 737465