Published April 10, 2019 | Version v1
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Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing


X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.



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MICROPRINCE – Pilot line for micro-transfer-printing of functional components on wafer level 737465
European Commission