Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
Description
X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.
Files
Naumann_CAM_WS-µTP-IWMS.pdf
Files
(2.1 MB)
| Name | Size | Download all |
|---|---|---|
|
md5:4ea2e58fc9f16588bda8e8b4416fb664
|
2.1 MB | Preview Download |