AddMorePower

Part of EU Open Research Repository
Published April 4, 2024 | Version v1
Project deliverable Open

Documentation of domain-level ontologies - CHADAs & MODAs (D2.2)

Description

D2.2 includes the systematic description and documentation of materials modelling and characterization data created in AddMorePower. To allow interoperability, AddMorePower uses the community standards CHADA and MODA.

Files

AddMorePower-D2.2-PU-M11.pdf

Files (687.4 kB)

Name Size
md5:bc1c9ef4012f98feaa2ac3150ca29051
687.4 kB Preview Download

Additional details

Funding

European Commission
AddMorePower - Advanced modelling and characterization for power semiconductor materials and technologies 101091621

References

  • CWA 17815 – Materials characterisation – Terminology, metadata and classification, October 2021
  • CWA 17284 – Materials modelling – Terminology, classification and metadata, October 2018
  • Emmc.eu, MODA template, 2021.
  • Emmc.eu, MODA workflow template, 2021.
  • M. Sebastiani, C. Charitidis, E. P. Koumoulos, CHADA docx detailed forms, Zenodo, 2019, doi: https://doi.org/10.5281/zenodo.2637419
  • T. Aichinger, M. Nelhiebel, S. Einspieler, T. Grasser, In-situ Polyheater - a reliable tool for performing fast and defined temperature switches on chip, IEEE Transactions on Device and Materials Reliability, vol. 10, no. 1, pp. 3-8, 2010, doi: 10.1109/TDMR.2009.2033467.
  • S. Moser, G. Zernatto, M. Kleinbichler, M. Nelhiebel, J. Zechner, M. J. Cordill, R. Pippan, A Novel Setup for In Situ Monitoring of Thermomechanically Cycled Thin Film Metallizations. JOM 71, 3399–3406, 2019, doi: https://doi.org/10.1007/s11837-019-03695-2
  • M. Sebastiani, C.Charitidis, E. P. Koumoulos, Main Introduction to the CHADA concept and case studies, Zenodo, 2019, doi: https://doi.org/10.5281/zenodo.2636609
  • S Moser, M Kleinbichler, S Kubicek, J Zechner, M. J, Cordill, Electropolishing – a practical method for accessing voids in metal films for analyses, Applied Sciences 11, no. 15: 7009, 2021, doi: https://doi.org/10.3390/app11157009
  • L. Hucht, Correlation of pore formation and microstructural characteristics by linking SEM and EBSD data - application to the Cu metallization of power devices, Master Thesis, University Duisburg-Essen, Duisburg-Essen, 2022
  • S. Bigl, S. Wurster, M.J. Cordill, D. Kiener, Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations, Thin Solid Films, Vol. 612, pp. 153-164, 2016, doi: https://doi.org/10.1016/j.tsf.2016.05.044