Published December 1, 2025
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D5.3 Design of Sub-THz Transceiver Circuits and H-Band Plastic Waveguide
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This deliverable D5.3 describes the design and evaluation of sub-THz transceiver circuits, transceiver packaging, in-package interconnects, as well as polymer microwave fibre (PMF) and PMF transitions. It is based on the work done in task 5.2. These components will be the input for task 6.4, to enable energy efficient high data rate links in distributed data processing.
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D5.3.pdf
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(30.4 MB)
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