AIDAinnova

Part of EU Open Research Repository
Published November 24, 2025 | Version v1
Project deliverable Open

Test of the final ultra-thin hybrid assemblies from wafer-to-wafer bonding

Authors/Creators

  • 1. Rheinische Friedrich-Wilhelms Universität Bonn Physikalisches Institut
  • 2. ROR icon Charité - Universitätsmedizin Berlin

Description

This deliverable report summarizes the results of test structures developed within technologies for wafer-to-wafer hybridization. This effort resulted in demonstration that this approach is feasible for radiation sensors and FE electronics as used for hybrid pixel detectors although a final prototype with real pixel and FE electronics could not yet be achieved within the time frame of the project.

 

Files

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Additional details

Funding

European Commission
AIDAinnova - Advancement and Innovation for Detectors at Accelerators 101004761

Dates

Submitted
2025-11-24