HORIZON DiMAT: Digital Modelling and Simulation for Design, Processing and Manufacturing of Advanced Materials

Part of EU Open Research Repository
Published December 18, 2024 | Version v1
Conference paper Open

Modeling and Simulation of Curing Cycle of Thermoset Epoxy Resin: Comparison of OpenFOAM solver and licensed simulation software

Authors/Creators

  • 1. ROR icon Universitat Politècnica de València
  • 2. CETMA
  • 3. Centro di Ricerche Europeo di Tecnologie Design e Materiali

Description

This work introduces a novel approach by modifying an existing solver used to calculate the curing resin process simulation analysis. The laplacianFoam solver was used as the starting point, adding new features to the heat equation and the evolution equation of the resin curing degree. This modification led to the development of a new solver with significantly enhanced capacity. To validate its efficiency, a typical differential scanning calorimetry (DSC) curve of a resin was considered, corroborating the outcome results. Furthermore, a comparison was made between the experimental data results and those from a licensed simulation software, demonstrating the superior performance of the developed solver with over 96% accuracy. This research also presents a more practical approach than the licensed simulation software.

Files

Modeling andSimulation Curing Cycle - Publication.pdf

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Additional details

Funding

European Commission
DiMAT - Digital Modelling and Simulation for Design, Processing and Manufacturing of Advanced Materials 101091496

Dates

Accepted
2024-12-18

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