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Published June 25, 2003 | Version v1
Conference paper Open

Thermal component models for electro thermal analysis of multichip power modules

Authors/Creators

  • Rodriguez, J. J.
  • Parrilla, Z.
  • Velez-Reyes, M.
  • Hefner, A.
  • Berning, D.
  • Reichl, J.
  • Lai, J.

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DOI
10.1109/ias.2002.1044094
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DOI

10.1109/ias.2002.1044094

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Created
June 4, 2018
Modified
August 2, 2024

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