SUMCASTEC Participants Community
Published January 17, 2018 | Version last author's draft
Conference paper Open

SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Creators

  • 1. IHP Microelectronics

Description

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ". 

Files

SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft.pdf

Files (2.6 MB)

Additional details

Funding

SUMCASTEC – Semiconductor-based Ultrawideband Micromanipulation of CAncer STEm Cells 737164
European Commission