Published February 12, 2024 | Version v1
Publication Open

The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes

Creators

  • 1. ROR icon International Solar Energy Research Center Konstanz
  • 2. ROR icon Nagase ChemteX (Japan)
  • 3. ROR icon Fraunhofer Center for Silicon Photovoltaics
  • 4. ROR icon Anhalt University of Applied Sciences

Files

Devoto_2024_PiP_The effects of increasing filler loading on the contact resistivity of interconnects based on silver–epoxied conductive adhesives and silver metallization pastes.pdf

Files (2.9 MB)

Additional details

Funding

European Commission
IBC4EU – Piloting novel cost-competitive bifacial IBC technology for vertical integrated European GW scale PV production value chain 101084259

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