Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT
Creators
- 1. TU Dresden, Institute of Electromechanical and Electronic Design
- 2. Fraunhofer Institute for Integrated Circuits, Division Engineering of Adaptive Systems
Description
System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.
Files
ZuE2017_pp66_73.pdf
Files
(1.0 MB)
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Additional details
Related works
- Is part of
- 978-3-8007-4444-2 (ISBN)