Published September 18, 2017 | Version v1
Journal article Open

Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT

  • 1. TU Dresden, Institute of Electromechanical and Electronic Design
  • 2. Fraunhofer Institute for Integrated Circuits, Division Engineering of Adaptive Systems


System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.



Files (1.0 MB)

Name Size Download all
1.0 MB Preview Download

Additional details

Related works

Is part of
978-3-8007-4444-2 (ISBN)


MICROPRINCE – Pilot line for micro-transfer-printing of functional components on wafer level 737465
European Commission