High-efficiency cooling via the monolithic integration of copper on electronic devices
Creators
- 1. University of Illinois at Urbana Champaign
- 2. University of California, Berkeley
Description
This is the repository of source files used in the article: High efficiency cooling via the monolithic integration of copper on electronic devices.
According to the guidance of Nature Electronics, we upload source files to a public repository.
In detail,
Data.zip contains the data used to plot Figures 1, 3, 4 and 5.
SD_Analysis.m contains the MATLAB script used to compute the spreading depth and thermal resistance (Figures 4b and 4c).
Ansys_TempCycle_Input.zip contains Ansys input files used to compute the strain energy density and von Mises stress (Figure 5).
Icepak_AsymSpread_Input.zip contains Ansys Icepak input files used to compute the spreader thermal resistance (Supplementary Figure S9) for one representative case.
Input files for other cases are available from the corresponding author on reasonable request.