Published February 28, 2022 | Version 1
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Comparative analysis of Printed Circuit Boards with Surface and Embedded Components under Natural and Forced Convection

Creators

  • 1. Moscow Aviation Institute (National Research University)
  • 2. Kiratech Srl

Contributors

Project member:

  • 1. Moscow Aviation Institute (National Research University)

Description

Figures of heat distribution on PCB depending on the installation method (surface and embedded) and the speed of forced airflow.

Files

Modelling Results.zip

Files (359.3 kB)

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