Published January 10, 2022 | Version v1
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Ga interaction with ZnO surfaces: Diffusion and melt-back etching

  • 1. CEITEC BUT, Brno University of Technology, Purkyňova 123, 612 00 Brno, Czech Republic
  • 2. Instituto de Microelectrónica de Barcelona (IMB-CNM, CSIC), Campus UAB, 08193 Cerdanyola del Vallès, Barcelona, Spain

Description

Despite being technologically very attractive, highly-doped zinc oxide whiskers with precisely defined morphology and doping level are difficult to prepare. Here, as an advancing step towards this goal, we show that pre-annealing of ZnO in oxygen-poor conditions (e.g. high vacuum) encourages a deeper diffusion of Ga into the ZnO crystal lattice in contrast to ZnO pre-annealed in oxygen-rich conditions. We also demonstrate that gallium acts as a reactant causing ZnO etching at diffusion temperatures, contrary to Al-based doping of ZnO systems. This behaviour, being similar to gallium melt-back etching during GaN epitaxy on silicon, has not been observed for ZnO so far and can represent a significant hurdle for the post-growth diffusion doping of ZnO nanostructures. The paper suggests possible ways how to diminish this effect.

Notes

We acknowledge Lukáš Kachtík for discussions of TEM data and Tomáš Musálek for deposition of Ga layers in the complex UHV system. The research was supported by European Commission (H2020-Twinning project No. 810626 – SINNCE) and Brno University of Technology (Specific research No.*FSI-S-20-6485). Stella Vallejos acknowledges the support of the Spanish Ministry of Science and Innovation via PID2019-107697RB-C42 (AEI/FEDER, EU). Part of the work was carried out with the support of CEITEC Nano Research Infrastructure (ID LM2018110).

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