Influences of bath chemistry and complexing agent on plating rate in electroless copper methane sulphonate bath

R&D, Bharathiar University, Coimbatore-641 046, Tamil Nadu, India

RMK College of Engineering and Technology, Puduvoyal, Chennai-601 206, India RMD

Engineering College, Kavaraipettai, Chennai-601 206, India

E-mail: rekhaperichiappan@gmail.com

Manuscript received online 12 October 2020, revised and accepted 27 November 2020

In electroless bath the ingredient which can change the kinetics of the plating process is called a complexing agent. The complexing agent slows down the rate of deposition and improves the deposit qualities. Dietheylene triamine pentaacetic acid (DTPA) is used as complexing agent. It shows high stability and rate of deposition, as it is an octadendate ligand compared to EDTA. The novel electroless plating bath is optimized with copper methane sulphonate, formaldehyde and DTPA as complexing agent and rate of deposition is studied by gravimetry. The formation of complex with metal ion greatly influences reduction of cupric ion in a strong base. The complex formed between ligand and metal ion alters the mixed potential and affects the copper deposition rate. In present study, the new bath is investigated with DTPA and compared with traditional EDTA bath by weight gain method.