Published February 23, 2021 | Version v1
Dataset Open

Ultrahigh vacuum packaging and surface cleaning for quantum devices

Authors/Creators

  • 1. IBM Quantum, IBM Research Europe–Zurich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland
  • 2. IBM Quantum, IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA

Description

Datasets associated with the paper "Ultrahigh vacuum packaging and surface cleaning for quantum devices". Datasets for the plots in Figures 4, 5, 6 and Table I are provided. Toc.pdf links the data to the figures and adds information on how the data can be reproduced.

Files

UHV_packaging_data.zip

Files (1.6 MB)

Name Size Download all
md5:9d690bebb844697d7a420d1ab950840d
1.6 MB Preview Download

Additional details

Related works

Is published in
Journal article: 10.1063/5.0034574 (DOI)
Preprint: arXiv:2010.12090 (arXiv)

Funding

Swiss National Science Foundation
NCCR QSIT: Quantum Science and Technology (phase III) 51NF40-185902