Emerging Molecular and Atomic Level Techniques for Nanoscale Applications

The need for tighter control over film uniformity, conformality, and properties at decreasing thicknesses was met by a gradual evolution from physical vapor deposition (PVD), to chemical vapor deposition (CVD), and eventually atomic layer deposition (ALD) processes. Of all manufacturing-worthy thin-film deposition processes, ALD has the greatest potential to satisfy these requirements. However, the intrinsic constraints of recurrent two atom reactivity and associated byproducts have kindled tremendous interest in other self-limiting deposition processes such as Molecular Layer Deposition (MLD), Self-Assembled Monolayer (SAM), and “Click” Chemistry Deposition (CCD) processes, either as alternatives to or in conjunction with ALD. This overview provides definitions, illustrations and examples of these processes.