Conference paper Open Access
Through Silicon Vias in MEMS packaging, a review
Guido Sordo; Cristian Collini; Sigurd Moe; Daniel Nilsen Wright
Trough Silicon Via (TSV) is a key enabling technology to achieve the integration of various dies by exploiting the third dimension. This allow the integration of heterogeneous chips in a single package (2.5D integration) or to achieve higher integration densities of transistors (3D integration). These vertical interconnections are widely used for both IC and MEMS devices. This paper reviews TSV technology focusing on their implementation in MEMS sensors with a broad overview on the various fabrication approaches and their constraints in terms of process compatibility. A case study of an inertial MEMS sensor will then be presented.
| Name | Size | |
|---|---|---|
|
Sordo_NordPac_2019.pdf
md5:54e336be838318b492265ab1504994f8 |
1.6 MB | Download |
| All versions | This version | |
|---|---|---|
| Views | 100 | 100 |
| Downloads | 56 | 56 |
| Data volume | 91.0 MB | 91.0 MB |
| Unique views | 95 | 95 |
| Unique downloads | 54 | 54 |
- Publication date:
- February 13, 2020
- DOI:
-
- Keyword(s):
- Trough Silicon Via TSV MEMS Sensors Integration zero-level packaging
- Grants:
-
European Commission:
- MUPIA - Manufacturing process for ultimate performance inertial MEMS Gyroscope (MUPIA) (785337)
- Meeting:
- The Nordic Conference on Microelectronics Packaging 2019 (NordPac 2019), Lyngby, Denmark, 11th-13th June 2019 (Session T1A Ever increasing density)
- Related identifiers:
- Has part
- 978-91-519-2089-4 (ISBN) (Conference paper)
- License (for files):
- Creative Commons Attribution 4.0 International