Book section Open Access
Design Methodologies and Co-Design Options for Novel 3D Technologies
Fischbach, Robert;
Lienig, Jens;
Horst, Tilman
Three-dimensional (3D) technologies enable faster, smaller and more energy efficient systems. Moreover, after more than
two decades of research, the technologies are mature and ready for industrial application. However, only few developers
make use of them and adoption by market is lagging behind. One of the main reasons is that 3D technologies are difficult
to be integrated into existing two-dimensional (2D) design flows, with the latter often wasting the potential promised by
3D technologies. Therefore, 3D-compatible design flows, with an emphasis on co-design between various 3D hierarchy
levels, are required. In this paper, we first give an overview of the most relevant and mature 3D technologies. Subsequently,
we investigate related design methodologies in order to find so far neglected potentials for design optimiza
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- Publication date:
- January 31, 2020
- DOI:
-
- ISBN:
- ISBN: 978-3-8007-4754-2
- Published in:
- GMM-Fb. 91: ANALOG 2018, VDE Verlag, pp. 181-186 (ISBN: 978-3-8007-4754-2).
- Grants:
-
European Commission:
- MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
- Communities:
- License (for files):
- Creative Commons Attribution 4.0 International