High-Density QFN Leadframe Package for Power Applications

One of the known technology for surface mount devices with multiple input/output (I/O) requirements for power applications is a semiconductor quad flat no-leads multi-row (QFN-MR) leadframe package

Realization of this technology is through incorporating a “chemical etching” process in the end-of-line (EOL) process steps where the exposed copper from the leadframe material is removed chemically