Presentation Open Access
Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.
Name | Size | |
---|---|---|
Naumann_CAM_WS-µTP-IWMS.pdf
md5:4ea2e58fc9f16588bda8e8b4416fb664 |
2.1 MB | Download |
All versions | This version | |
---|---|---|
Views | 118 | 118 |
Downloads | 343 | 343 |
Data volume | 704.3 MB | 704.3 MB |
Unique views | 108 | 108 |
Unique downloads | 288 | 288 |