Presentation Open Access
Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank
X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.
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Naumann_CAM_WS-µTP-IWMS.pdf
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- Publication date:
- April 10, 2019
- DOI:
-
- Keyword(s):
- micro-transfer printing
- Grants:
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European Commission:
- MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
- Meeting:
- International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019), Halle, Germany, 10-11 April 2019
- Communities:
- License (for files):
- Creative Commons Attribution 4.0 International