Presentation Open Access
Transfer printing for heterogeneous silicon PICs
Roelkens, Gunther; Zhang, Jing; Kumari, Sulakshna; Juvert, Joan; Liles, Alexandros; Muliuk, Grigorij; Goyvaerts, Jeroen; Hag, Bahawal; Mahmoud, Nayyera; Van Thourhout, Dries
Photonic integrated circuits (PICs), implementing optical functions such as light generation, modulation, routing and detection on a single chip, are emerging as a powerful platform to realize miniaturized optical systems. These chips find applications in various fields, ranging from high-speed optical transceivers to disposable bio-sensors, LiDARs for detection and ranging, spectroscopic analytical sensors, etc.
Files
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Abstract_TP_imec_SSI_v2.pdf
md5:2c9351ed16394fd5bc637def3005ad9f |
319.2 kB | Download |
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april2019_SSI_invited.pdf
md5:ca94cde135c424aaa9ee8c4cb5dd3ef7 |
4.6 MB | Download |
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Indexed in
- Publication date:
- April 30, 2019
- DOI:
-
- Keyword(s):
- Photonic integrated circuits Silicon photonics
- Grants:
-
European Commission:
- MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
- Meeting:
- Smart Systems Integration, Barcelona, Spain, 10-11 April 2019
- Communities:
- License (for files):
- Creative Commons Attribution 4.0 International