Published April 10, 2019 | Version v1
Presentation Open

MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level

  • 1. X-FAB MEMS Foundry GmbH
  • 2. X-FAB Semiconductor Foundries GmbH
  • 3. Fraunhofer IMWS
  • 4. X-Celeprint US
  • 5. X-Celeprint Ireland

Description

Micro-transfer-printing (μTP) represents a versatile micro-assembly technology which has been developed in laboratory and (for photo-voltaic application) in an industrial environment over the last ten years. Within the European funded ECSEL project “MICROPRINCE” the worldwide first open access pilot line for μTP will be installed in the clean room facilities of the X-FAB MEMS Foundry GmbH. Moreover, the project possesses the objective to demonstrate the capabilities of this pilot line for heterogeneous integration of different application scenarios. Therefore, functional components for several target applications will be transferred and assembled on wafer level and the benefits of the μTP technology will be explained.

Files

SSI19_Abstract-MICROPRINCE-XFAB.pdf

Files (6.4 MB)

Name Size Download all
md5:08529d1caba35288f4081699645e44e4
232.9 kB Preview Download
md5:d314d6e1d215c665dd000e7771d6708b
6.2 MB Preview Download

Additional details

Related works

Is supplemented by
10.5281/zenodo.2654512 (DOI)

Funding

MICROPRINCE – Pilot line for micro-transfer-printing of functional components on wafer level 737465
European Commission