MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
Creators
- 1. X-FAB MEMS Foundry GmbH
- 2. X-FAB Semiconductor Foundries GmbH
- 3. Fraunhofer IMWS
- 4. X-Celeprint US
- 5. X-Celeprint Ireland
Description
Micro-transfer-printing (μTP) represents a versatile micro-assembly technology which has been developed in laboratory and (for photo-voltaic application) in an industrial environment over the last ten years. Within the European funded ECSEL project “MICROPRINCE” the worldwide first open access pilot line for μTP will be installed in the clean room facilities of the X-FAB MEMS Foundry GmbH. Moreover, the project possesses the objective to demonstrate the capabilities of this pilot line for heterogeneous integration of different application scenarios. Therefore, functional components for several target applications will be transferred and assembled on wafer level and the benefits of the μTP technology will be explained.
Files
SSI19_Abstract-MICROPRINCE-XFAB.pdf
Files
(6.4 MB)
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Additional details
Related works
- Is supplemented by
- 10.5281/zenodo.2654512 (DOI)