Published July 7, 2018
| Version v1
Journal article
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HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC.
Creators
- 1. Accurex Solutions (P) Ltd., # 782, 3rd Main, 1st Cross, BEML Layout, 5th Stage, Rajarajeswari Nagar, Bangalore 560 098, India.
Description
Problems associated with assembly and packaging of two accelerometer Micro Electro Mechanical Sensors (MEMS) and associated Read Out Integrated Circuit (ROIC) into a single compact package as per customer requirements were discussed, analysed and a High Temperature Co-fired Ceramic (HTCC) solution was suggested.
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