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SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ". 

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