Conference paper Open Access

SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper entitled "BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications ". 

13
61
views
downloads
Views 13
Downloads 61
Data volume 159.9 MB
Unique views 12
Unique downloads 61
More info on how stats are collected.
Indexed in
Publication date:
January 17, 2018
DOI:
10.1109/ECTC.2017.153

Zenodo DOI Badge

DOI 

10.1109/ECTC.2017.153

Markdown 

[![DOI](https://zenodo.org/badge/DOI/10.1109/ECTC.2017.153.svg)](https://doi.org/10.1109/ECTC.2017.153)

reStructedText 

.. image:: https://zenodo.org/badge/DOI/10.1109/ECTC.2017.153.svg
   :target: https://doi.org/10.1109/ECTC.2017.153

HTML 

<a href="https://doi.org/10.1109/ECTC.2017.153"><img src="https://zenodo.org/badge/DOI/10.1109/ECTC.2017.153.svg" alt="DOI"></a>

Image URL 

https://zenodo.org/badge/DOI/10.1109/ECTC.2017.153.svg

Target URL 

https://doi.org/10.1109/ECTC.2017.153

Grants:
European Commission:
  • SUMCASTEC - Semiconductor-based Ultrawideband Micromanipulation of CAncer STEm Cells (737164)
Communities:
License (for files):
Creative Commons Attribution 4.0 International

Share

Cite as

Export