MICROPRINCE - Pilot Line for Micro-Transfer-Printing of Functional Components on Wafer Level

Part of EU Open Research Repository
Published May 16, 2017 | Version v1
Conference paper Open

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Authors/Creators

  • 1. X-FAB MEMS Foundry GmbH
  • 2. Fraunhofer Institute for Electronic Nano Systems
  • 3. X-Celeprint Inc.

Description

This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.

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20170407_LTB3D-2017_X-FAB.pdf

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Additional details

Funding

European Commission
MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level 737465