Conference paper Open Access

Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.

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Publication date:
May 16, 2017
DOI:
10.5281/zenodo.1043259

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10.5281/zenodo.1043259

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Grants:
European Commission:
  • MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
Meeting:
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, 16 May - 18 May 2017
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License (for files):
Creative Commons Attribution Non Commercial 4.0 International

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