Published October 27, 2016 | Version v1
Conference paper Open

The ExaNeSt Project: Interconnects, Storage, and Packaging for Exascale Systems

  • 1. Foundation For Research & Technology – Hellas (FORTH)
  • 2. University of Manchester (UoM)
  • 3. National Institute for Nuclear Physics (INFN)
  • 4. Iceotope Technologies Ltd. (ICEOTOPE)
  • 5. Istituto Nazionale di Astrofisica (INAF)
  • 6. eXact lab srl (eXactlab)
  • 7. MonetDB Solutions (MDBS)
  • 8. Universitat Politècnica de València (UPV)
  • 9. Virtual Open Systems (VOSYS)
  • 10. Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V (Fraunhofer)
  • 11. Allinea Software Ltd (Allinea)
  • 12. EnginSoft S.p.A. (EnginSoft)


ExaNest is one of three European projects that support a ground-breaking computing architecture for exascale-class systems built upon power-efficient 64-bit ARM processors. This group of projects share an “everything-close” and “share-anything” paradigm, which
trims down the power consumption –by shortening the distance of signals for most data transfers– as well as the cost and footprint area of the installation –by reducing the number of devices needed to meet performance targets. In ExaNeSt, we will design and implement: (i) a physical rack prototype and its liquid-cooling subsystem providing ultra-dense compute packaging; (ii) a storage architecture with distributed (in-node) non-volatile memory (NVM) devices; (iii) a unified, low-latency interconnect, designed to efficiently uphold desired Quality-of-Service guarantees for a mix of storage with inter-processor flows; and (iv) efficient rack-level memory sharing, where each page is cacheable at only a single node. Our target is to test alternative storage and interconnect options on actual hardware, using real-world HPC applications. The ExaNeSt consortium brings together technology, skills, and knowledge across the entire value chain, from computing IP, packaging, and system deployment, all the way up to operating  systems, storage, HPC, big data frameworks, and cutting-edge applications.


This paper appears in the IEEE Proceedings of the Euromicro Conference on Digital System Design (DSD 2016), 31 Aug. - 2 Sept. 2016, Limassol, Cyprus. Its camera-ready version is provided at



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ExaNeSt – European Exascale System Interconnect and Storage 671553
European Commission