Published March 8, 2023
| Version v1
Poster
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Second butt joint for low loss waveguides
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Description
We present a new integration scheme for the InP based platform to monolithically integrated low-loss passive waveguides in the SMART photonics integrated circuits (PICs) platform. This method consists of performing a butt joint in the top layer of our wafers. This allows to have two different top claddings on the same wafer, one heavily doped optimized for active and one undoped optimized for passive elements
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Waveguides_and_Fibers_01(4).pdf
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(171.8 kB)
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