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Published February 6, 2023 | Version v1
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Hybrid 2D/CMOS microchips for memristive applications - Computer software and raw data

  • 1. Materials Science and Engineering Program, Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia
  • 2. Institute of Microelectronics, Tsinghua University, 100084, Beijing, China
  • 3. Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano, Piazza L. da Vinci 14, 20133 Milano, Italy
  • 4. Department of Thermal and Fluid Engineering, Faculty of Engineering Technology, University of Twente, Enschede, Netherlands
  • 5. Institute of Functional Nano & Soft Materials, Collaborative Innovation Center of Suzhou Nanoscience and Technology, Soochow University, 199 Ren-Ai Road, Suzhou 215123, China
  • 6. Computer, Electrical and Mathematical Sciences and Engineering Division, King Abdullah University of Science and Technology, Thuwal, 23955-6900, Saudi Arabia
  • 7. Departamento de Electrónica y Tecnología de Computadores, Facultad de Ciencias, Universidad de Granada, Avenida Fuentenueva s/n, 18071 Granada, Spain
  • 8. Department of Electrical Engineering and Media Technology, Deggendorf Institute of Technology, Dieter‐Görlitz‐Platz 1, 94469 Deggendorf, Germany
  • 9. Institute for Microelectronics, TU Wien, Gusshausstrasse 27-29, 1040 Vienna, Austria

Description

Source data for the paper "Hybrid 2D/CMOS microchips for memristive applications"

Files

Nature_data.zip

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