INVESTIGATION OF ANISOTROPIC PROPERTIES OF THERMAL INSULATION

This article is devoted to the study of a thermal diode. Since a significant amount of heat loss is carried out through cracks, cracks in buildings, with poorly selected thermal insulation, it is necessary to use the heat difference between ambient temperatures and indoor temperatures most effectively. The research was carried out using the SolidWorks software product and the Fluke Ti400 thermal imager.