Published April 22, 2022 | Version v1
Conference paper Open

Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

  • 1. KAI GmbH
  • 2. Infineon Technologies Austria

Description

This paper presents a novel test system, which is optimized to simulate temperature mission profiles of various applica-
tions, which exhibit large temperature changes. The aim is to treat the investigated power semiconductor as a “black box”
without the need for a lifetime model. A microcontroller controls the self-heating of the device under test to generate the
necessary power losses. Simultaneously the microcontroller acquires measurement data of the device under test (DUT)
based on a pre-defined test plan. To simulate also negative ambient temperatures the DUT is mounted on a cooling system.
The test system has a high flexibility within a wide temperature range and can be used to simulate various application
conditions, especially for applications with a large temperature swing. A mission profile focusing on the application of
power semiconductors within solar inverters is used as a reference. Based on such a mission profile, heating current, gate
voltage and chiller temperature are adjusted automatically to drive the system to all temperature conditions the DUT is
expected to be exposed to during its lifetime in its target application.

Files

paper_cips2022_kostynski.pdf

Files (1.7 MB)

Name Size Download all
md5:64b896bf6418936cc4a0c81e46a491bd
1.7 MB Preview Download

Additional details

Funding

European Commission
iRel40 - Intelligent Reliability 4.0 876659