PCBSPDefect Dataset: PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes

This is the PCBSPDefect Dataset for the journal paper "PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes".

It consists of different sizes of training subsets, with dedicated validation set and test set, for fair comparison.

Abstract

To increase the reliability of the printed circuit board (PCB) manufacturing process, automated optical inspection is often employed for soldering defect detection. However, traditional approaches built on handcrafted features, predefined rules, or thresholds are often susceptible to the variation of the acquired images’ quality and give unstable performances. To solve this problem, a deep learning-based soldering defect detection method is developed in this article. Like many real-life deep learning applications, the number of available training samples is often limited. This creates a challenging low-data scenario, as deep learning typically requires massive data to perform well. To address this issue, a multitask learning model is proposed, namely, PCBMTL, that can simultaneously learn the classification and segmentation tasks under low-data regimes. By acquiring the segmentation knowledge, classification performance is substantially improved with few samples. To facilitate the study, a soldering defect image
dataset, namely, PCBSPDefect, is built. It focuses on the dual in-line packages (DIP) at the PCB back side, DIP at the PCB front side, and flat flexible cables. Experimental results show that the proposed PCBMTL outperforms the best existing approaches by over 5–17% of average accuracy for different datasets.

Please cite the paper for the PCBSPDefect dataset: "Tsang, S., Suo, Z., Chan, T.T., Nguyen, H. and Lun, D.P. (2023), PCB Soldering Defect Inspection Using Multitask Learning under Low Data Regimes. Adv. Intell. Syst., 5: 2300364. https://doi.org/10.1002/aisy.202300364"