Multi-Wire Module Modeling, Measuring and More

Published September 14, 2026 | Version V2

Poster Open

Objective: Understanding impacts of Ag finger metallization and Cu interconnect wire layout on performance and materials.

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EUPVSEC2026-3AV.1.23-Poster-JG.pdf md5:fc06bfafa5d8f4acc97ada001fca0866	933.2 kB	Preview Download

European Commission
SHINE PV - Sustainable, High-throughput, Industry-ready, Next-generation technology for European manufacturing leadership in PV 101172902

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DOI

Resource type

Poster

Publisher

Zenodo

Conference

43rd European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC 2026) , Rotterdam, the Netherlands (World Trade Centre), 14–18 September 2026 (Session 3AV.1, Part 23)

Languages

English

License: Creative Commons Attribution 4.0 International

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