wafer-proc-sim: Data-quality-aware heteroscedastic GP surrogate for 4H-SiC blade dicing

Open-source framework for 4H-SiC blade dicing process optimization combining physics-based simulation, heteroscedastic Gaussian process surrogates, Ensemble Kalman Filter state estimation, and Bayesian optimization. Core paper path is reproducible via scripts/reproduce_paper.sh with CI-regression-tested LOO metrics.