Published December 3, 2025 | Version v1
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Multiscale Dynamics in Wafer Bonding: Mechanisms Driving the Bond Front (Session 1: Fundamentals)

Authors/Creators

  • 1. ROR icon IMEC

Description

Slides presented in Chemnitz at conference "Waferbond '25" on 3 Dec 2025

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Additional details

Funding

European Commission
NanoIC - European pilot line for beyond 2nm leading edge System-on-Chip leadership 101183277
European Union
Chips Joint Undertaking 101183266