Published May 19, 2026 | Version v1

SGS-Based P+ −P Microbridge Architecture for Harsh-Environment Accelerometers

Authors/Creators

  • 1. Scientific Research Technological Institute of Instrument Engineering_(Ukraine)

Description

Piezoresistive accelerometers utilizing a distributed-parameter microbridge (µMC) circuit in a p+-p silicon structure offer a reliable alternative to piezoelectric sensors for extreme operating conditions. This work updates fundamental research from the late 1980s on monolithic integrated piezoresistive transducers by integrating “silicon
glass-silicon” (SGS) technology and modern multiphysics modeling (COMSOL). This approach eliminates the use of insulating p-n junctions, involves heavy doping of the
piezoresistive channels, and utilizes charge carrier redistribution in the channels and the elastic element to ensure stable operation at temperatures up to 350◦C and accelerations up to 10,000 g. Simulations confirm excellent performance over a wide range (from ±30 g to ±6000 g) with minimal temperature drift, as well as static and dynamic capabilities and compatibility with commercial data acquisition systems,

Notes

This work is a peer-reviewed article titled "SGS-Based P+ −P Microbridge Architecture for Harsh-Environment Accelerometers" by Michael Tikhomirov.

This record is an identical version of the research registered on the Open Science Framework (OSF).

OSF Registration DOI: 10.1149/osf.io/3m2yj_v1


The OSF registration contains the full study registration, simulation files, raw data tables, and supplementary materials.

License: Creative Commons Attribution 4.0 International (CC BY 4.0)  
Version: 1.0 (submitted version)

Keywords: piezoresistive accelerometer, SGS, silicon-glass-silicon, high-temperature sensor, MEMS, distributed microbridge, COMSOL

Files

SGS_Based_PpluP_Microbridge_Architecture_HEAccelerometers.pdf

Files (7.6 MB)

Additional details

References

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