Interlocking Geometric Filler Architecture for High-Power Semiconductor Packaging Thermal Networks

The rapid increase in power density of modern semiconductor devices—
including AI accelerators, GPUs, and stacked memory—has pushed
conventional thermal interface materials to their structural limits.
Existing packaging composites rely primarily on spherical or irregular filler
particles, which produce discontinuous thermal pathways and unstable particle
distributions.
This disclosure proposes a geometry-driven filler architecture, where anisotropic
particles with interlocking structures create mechanically stable and thermally
continuous networks inside polymer-based packaging materials.
Unlike traditional approaches that rely solely on filler loading ratio, this concept
introduces geometric mechanical interlocking as a structural parameter for
thermal conduction design.
The concept is openly disclosed to encourage further engineering exploration
and industrial implementation.