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Published 2026 | Version v2
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Quantum DIMM: A Three-Dimensional Stacked Architecture for Scalable Silicon Quantum Computing (Classical only)

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Description

The scalability of silicon-based quantum computers is fundamentally limited by electromagnetic
crosstalk between densely packed qubits and their control electronics. We present the "Quantum
DIMM," a three-dimensional stacked architecture that physically separates the quantum and
classical domains using a 10 μm silicon dioxide (SiO₂) dielectric layer. Through extensive finite
element simulations, we demonstrate that this architecture provides exceptional thermal isolation:
even under worst-case power dissipation of 5.12 W (5 mW/qubit × 1024 qubits), qubit
temperature elevation remains below 1.3 mK above the 4 K heat sink. The coaxial through-silicon
via (TSV) interconnects, optimized for 50 Ω impedance matching, achieve -140 dB crosstalk
attenuation—a 100+ dB improvement over planar designs. Combined with phosphorus donor spin
qubits operating at ~1 K, this architecture enables scalable quantum processors using mature
CMOS-compatible fabrication technologies. Our computational validation establishes a viable path
toward million-qubit fault-tolerant quantum computing.

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References

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