Dataset of "Stability Assessment of 3D Printed PVC/PVAc Filament from Waste Intended for PCB Substrates"

The growing emphasis on sustainability and circular economy principles has intensified research into the efficient recycling of polymer materials. However, the recycling of PVC and its blends remains challenging due to low thermal stability and the degradation that occurs during repeated processing. Here, we investigate the influence of aging on the behavior of material studied for printed circuit board substrates prepared from post-industrial PVC/PVAc waste by 3D printing. Using a range of measurement techniques, the properties of the substrates were characterized before and after accelerated aging (1−6 weeks). Size exclusion chromatography showed that, regardless of duration, aging did not significantly affect the molar mass of the material. Differential scanning calorimetry revealed that the glass transition temperature was fairly consistent, ranging from 73 to 77 °C, with a local maximum after 627 h of aging. Infrared spectroscopy demonstrated an exponential increase in the C=C or C=O to aliphatic C–H peak area ratio with aging time. Coupled thermogravimetric analysis-potentiometric titration showed that the amount of HCl released was largely unaffected by aging while that of the other degradation gases changed significantly. Overall, these results suggest that recycled PVC/PVAc materials retain sufficient performance after aging, but there is scope for improving the material through the incorporation of additional stabilizers and optimizing printing parameters before reusing this recycled waste material in sustainable additive manufacturing applications.