MIRELAI
Published November 3, 2025 | Version v1
Conference paper Open

Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography

Authors/Creators

  • 1. ROR icon Berliner Nanotest und Design
  • 2. ROR icon Chemnitz University of Technology
  • 3. ROR icon Brandenburg University of Technology Cottbus-Senftenberg
  • 4. ROR icon Fraunhofer Institute for Electronic Nano Systems

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S_PS_B_2_Wu_133.pdf

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Additional details

Funding

European Commission
MIRELAI - MIcroelectronics RELiability driven by Artificial Intelligence 101072491